Publicaciones en las que colabora con Josep Samitier Martí (10)

2005

  1. A methodology to extract dynamic compact thermal models under time-varying boundary conditions: Application to a thermopile based IR sensor

    Microsystem Technologies

  2. Dynamic compact thermal models with multiple power sources: Application to an ultrathin chip stacking technology

    IEEE Transactions on Advanced Packaging, Vol. 28, Núm. 4, pp. 694-703

2004

  1. Empirical validation of thermal dynamics in a silicon microthruster: Influence of boundary conditions

    Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

  2. Evolutionary algorithms for compact thermal modelling of microsystems: Application to a micro-pyrotechnic actuator

    Journal of Micromechanics and Microengineering, Vol. 14, Núm. 7, pp. 1074-1082

2001

  1. Improved multiexponential transient spectroscopy by iterative deconvolution

    IEEE Transactions on Instrumentation and Measurement, Vol. 50, Núm. 3, pp. 774-780

  2. Suboptimal filtering and nonlinear time scale transformation for the analysis of multiexponential decays

    IEEE Transactions on Instrumentation and Measurement, Vol. 50, Núm. 1, pp. 135-140

1999

  1. Non-linear time scale transformation for the analysis of multiexponential decays

    Conference Record - IEEE Instrumentation and Measurement Technology Conference, Vol. 2, pp. 1178-1182

1998

  1. A time-domain method for the analysis of thermal impedance response preserving the convolution form

    THERMINIC: COLLECTION OF PAPERS PRESENTED AT THE INTERNATIONAL WORKSOP ON THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES

  2. Improved multi-exponential transient spectroscopy by iterative deconvolution

    Conference Record - IEEE Instrumentation and Measurement Technology Conference

  3. Time-domain method for the analysis of thermal impedance response preserving the convolution form

    Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures